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Intel Montevina Mobile Technology

October 11, 2006 at 06:22:00 AM, by Thai Tan Rating: 3 out of 5

Today its Core 2 Duo, next up is Santa Rosa, and after is Montevina.

Intel plans to ship the Santa Rosa mobile technology platform in early 2007, but they're also working on the next major Centrino technology update codenamed "Montevina", due in 2008.

Montevina technology comes with the chipset called "Cantiga" and wireless module "Shiloh". Cantiga has a front side bus of 1,067MHz and will support DDR3 800MHz. The graphics core will be clocked at 475Mhz. Montevina will support Intel's 45nm die shrink "Penryn". Current generation Core 2 Duo processors are made from 65nm die. Penryn will ship in late 2007 and Intel will introduce a year later Nehalem, another 45nm with major architecture revision.

Penryn is said to consume no more than 29W, compared to Meron's (Core 2 Duo) 35W TDP.

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  1. imran at 00:55, February 25, 2009

    please forward me complete details on Intel Montevina Mobile Technology. thank u.

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